Heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition, composite comprising same and composite patch repair method

The invention provides a heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition, a composite comprising the same and a composite patch repair method, and belongs to the field of photocuring technology and resin matrix composites. The heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition is prepared from, by weight, 80-100 parts of epoxy resin, 5-30 parts of organosilicone resin, 1-5 parts of cationic initiator, 1-5 parts of thermal initiator, 0-1 part of photosensitizer and 0-0.5 part of filler. According to the heat and moisture resisting organosilicone-modified ultraviolet-curable resin composition, cationic polymerization is initiated under ultraviolet irradiation; decomposition of the thermal initiator can be promoted by heat release in polymerization, self-propagating curing from top to bottom under ultraviolet irradiation is achieved, the curing speed is high, the curing thickness is large, tests show that curing can be completed wit