DYNAMIC OR ADAPTIVE TRACKING OF SPECTRUM FEATURE PART FOR END POINT DETECTION
To provide an optical end point detection system that tracks characteristics of a selected spectrum feature part in spectrometry for determining an endpoint or changing the polishing speed and reduces processing resources by identifying the selected feature part. The polishing control method include...
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creator | LIM THIAN CHOI HARRY Q LEE GARY KA HO LAM JEFFREY DRUE DAVID |
description | To provide an optical end point detection system that tracks characteristics of a selected spectrum feature part in spectrometry for determining an endpoint or changing the polishing speed and reduces processing resources by identifying the selected feature part. The polishing control method includes: start polishing after receiving a user's input for selecting a fixed wavelength range; measuring a sequence of optical spectrum; searching a spectrum feature part selected in a wavelength range 708; obtaining a value of a feature 704; and determining at least one of a polishing endpoint and an adjustment concerning the polishing speed on the basis of a value sequence.
公开了用于终点检测的动态或适应性追踪光谱特征。种控制研磨的方法包括以下步骤:研磨基板;以及接收选定光谱特征的识别、具有宽度的波长范围,及该选定光谱特征的特性以在研磨期间进行监视。在研磨该基板的同时测量来自该基板的光的系列光谱。根据该系列光谱产生该选定光谱特征的该特性的系列值。对于来自该系列光谱的至少些光谱而言,基于该光谱特征在用于该系列光谱中的先前光谱的先前波长范围内的位置,产生修改波长范围,在该修改波长范围中搜寻该选定光谱特征,且确定该选定光谱特征的特性的值。 |
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公开了用于终点检测的动态或适应性追踪光谱特征。种控制研磨的方法包括以下步骤:研磨基板;以及接收选定光谱特征的识别、具有宽度的波长范围,及该选定光谱特征的特性以在研磨期间进行监视。在研磨该基板的同时测量来自该基板的光的系列光谱。根据该系列光谱产生该选定光谱特征的该特性的系列值。对于来自该系列光谱的至少些光谱而言,基于该光谱特征在用于该系列光谱中的先前光谱的先前波长范围内的位置,产生修改波长范围,在该修改波长范围中搜寻该选定光谱特征,且确定该选定光谱特征的特性的值。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161221&DB=EPODOC&CC=CN&NR=106252220A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161221&DB=EPODOC&CC=CN&NR=106252220A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIM THIAN CHOI</creatorcontrib><creatorcontrib>HARRY Q LEE</creatorcontrib><creatorcontrib>GARY KA HO LAM</creatorcontrib><creatorcontrib>JEFFREY DRUE DAVID</creatorcontrib><title>DYNAMIC OR ADAPTIVE TRACKING OF SPECTRUM FEATURE PART FOR END POINT DETECTION</title><description>To provide an optical end point detection system that tracks characteristics of a selected spectrum feature part in spectrometry for determining an endpoint or changing the polishing speed and reduces processing resources by identifying the selected feature part. The polishing control method includes: start polishing after receiving a user's input for selecting a fixed wavelength range; measuring a sequence of optical spectrum; searching a spectrum feature part selected in a wavelength range 708; obtaining a value of a feature 704; and determining at least one of a polishing endpoint and an adjustment concerning the polishing speed on the basis of a value sequence.
公开了用于终点检测的动态或适应性追踪光谱特征。种控制研磨的方法包括以下步骤:研磨基板;以及接收选定光谱特征的识别、具有宽度的波长范围,及该选定光谱特征的特性以在研磨期间进行监视。在研磨该基板的同时测量来自该基板的光的系列光谱。根据该系列光谱产生该选定光谱特征的该特性的系列值。对于来自该系列光谱的至少些光谱而言,基于该光谱特征在用于该系列光谱中的先前光谱的先前波长范围内的位置,产生修改波长范围,在该修改波长范围中搜寻该选定光谱特征,且确定该选定光谱特征的特性的值。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w_kBQo3ofiQXDZJLiFfBqRQ5J9FC_X_s4Ac4veXNTfI3xhQd5ArosUi8EkhFd458hBzgUshJbRMEQmkrQcEqEKZO7KHkyAKeZEox89LMHv1z1NXPhVkHEnfa6PDudBz6u7700zneNge7t9Y2uPvnfAHPQC31</recordid><startdate>20161221</startdate><enddate>20161221</enddate><creator>LIM THIAN CHOI</creator><creator>HARRY Q LEE</creator><creator>GARY KA HO LAM</creator><creator>JEFFREY DRUE DAVID</creator><scope>EVB</scope></search><sort><creationdate>20161221</creationdate><title>DYNAMIC OR ADAPTIVE TRACKING OF SPECTRUM FEATURE PART FOR END POINT DETECTION</title><author>LIM THIAN CHOI ; HARRY Q LEE ; GARY KA HO LAM ; JEFFREY DRUE DAVID</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106252220A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LIM THIAN CHOI</creatorcontrib><creatorcontrib>HARRY Q LEE</creatorcontrib><creatorcontrib>GARY KA HO LAM</creatorcontrib><creatorcontrib>JEFFREY DRUE DAVID</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIM THIAN CHOI</au><au>HARRY Q LEE</au><au>GARY KA HO LAM</au><au>JEFFREY DRUE DAVID</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DYNAMIC OR ADAPTIVE TRACKING OF SPECTRUM FEATURE PART FOR END POINT DETECTION</title><date>2016-12-21</date><risdate>2016</risdate><abstract>To provide an optical end point detection system that tracks characteristics of a selected spectrum feature part in spectrometry for determining an endpoint or changing the polishing speed and reduces processing resources by identifying the selected feature part. The polishing control method includes: start polishing after receiving a user's input for selecting a fixed wavelength range; measuring a sequence of optical spectrum; searching a spectrum feature part selected in a wavelength range 708; obtaining a value of a feature 704; and determining at least one of a polishing endpoint and an adjustment concerning the polishing speed on the basis of a value sequence.
公开了用于终点检测的动态或适应性追踪光谱特征。种控制研磨的方法包括以下步骤:研磨基板;以及接收选定光谱特征的识别、具有宽度的波长范围,及该选定光谱特征的特性以在研磨期间进行监视。在研磨该基板的同时测量来自该基板的光的系列光谱。根据该系列光谱产生该选定光谱特征的该特性的系列值。对于来自该系列光谱的至少些光谱而言,基于该光谱特征在用于该系列光谱中的先前光谱的先前波长范围内的位置,产生修改波长范围,在该修改波长范围中搜寻该选定光谱特征,且确定该选定光谱特征的特性的值。</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
title | DYNAMIC OR ADAPTIVE TRACKING OF SPECTRUM FEATURE PART FOR END POINT DETECTION |
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