An airtight surface-mounted type digital isolator package structure

The invention relates to an airtight surface-mounted type digital isolator package structure comprising IC chips, a voltage transformer chip, cover plates, a bonding wire, an insulating medium covering layer and a ceramic shell; the IC chip and the voltage transformer chip are mounted in a core cavity of the ceramic shell; all parts with weak voltage-resistance at input and output terminals in the package structure are covered with the insulating medium covering layer; and the IC chips, the voltage transformer chip, the bonding wire and the insulating medium covering layer adopt the ceramic shell and the cover plate to form an airtight sealed structure. According to the invention, the IC chips and the voltage transformer chip do not need to be redesigned to solve the problem of withstand voltages between the input and output terminals of the existing digital isolators, and problems of poor reliability and short usage life of existing plastic-packaged digital isolators caused by withstand voltage drop in a hum