ORGANIC LAYER COMPOSITION ORGANIC LAYER AND METHOD OF FORMING PATTERNS

The invention provides an organic layer composition and a method of forming patterns, wherein the organic layer composition includes a first compound being 10-70% in thermal-shrinkage rate, a second compound with the thermal-shrinkage rate being lower than that of hte first compound, and a solvent....

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Bibliographische Detailangaben
Hauptverfasser: KIM, MINSOO, BAEK, JAEYEOL, JEONG, SEULGI, YOON, BYERI, SONG, HYUNJI, HONG, SEUNGHEE, NAM, YOUNHEE, HWANG, SUNMIN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides an organic layer composition and a method of forming patterns, wherein the organic layer composition includes a first compound being 10-70% in thermal-shrinkage rate, a second compound with the thermal-shrinkage rate being lower than that of hte first compound, and a solvent. The invention also provides the organic layer formed by curing hte organic layer composition and a method of forming the patterns with the organic layer composition. The invention provides the organic layer of which the etching resistance and planarity characters are ensured. 本发明提供种有机层组成物以及形成图案的方法,该有机层组合物包含热收缩率为10%到70%的第化合物、热收缩率小于所述第化合物的第二化合物以及溶剂;以及种通过使所述有机层组成物固化获得的有机层以及种使用所述有机层组成物形成图案的方法。可以提供同时确保耐蚀刻性和平面化特征的有机层。