Process for plugging wafers into inner caps

The invention provides a process for plugging wafers into inner caps. A sealing structure is made to be fast compounded into the inner cap, and the production efficiency is improved. Raw sealing pieces are directly punched out of a whole raw material structure, and the punched raw sealing pieces are...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG XIAOLIN, XU MINXING, CHENG LIBIN, SHEN DUNJIE
Format: Patent
Sprache:chi ; eng
Schlagworte:
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