Process for plugging wafers into inner caps

The invention provides a process for plugging wafers into inner caps. A sealing structure is made to be fast compounded into the inner cap, and the production efficiency is improved. Raw sealing pieces are directly punched out of a whole raw material structure, and the punched raw sealing pieces are directly pressed into the inner caps of covers under the raw sealing pieces to complete compounding by use of a puncher pin. 本发明提供了种向内盖内塞圆片的工艺，其使得密封结构快速复合于内盖内，提高了生产效率。其利用整张原料结构直接冲压出原料密封片，冲压后的原料密封片直接被冲头下压至正下方的盖子的内盖内完成覆合。