Entire board package ceramic LED lamp filament and processing method thereof

Entire board package ceramic LED lamp filament and processing method thereof

The present invention discloses an entire board package ceramic LED lamp filament and a processing method thereof. An entire board package ceramic substrate is taken as a LED filament pedestal, and the entire board package ceramic substrate is divided into several bar-shaped ceramic substrate region...

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Hauptverfasser: Wang Donghai, Li Yunhan, Xu Xianmei, Lin Chengtong
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Wang Donghai
Li Yunhan
Xu Xianmei
Lin Chengtong
description The present invention discloses an entire board package ceramic LED lamp filament and a processing method thereof. An entire board package ceramic substrate is taken as a LED filament pedestal, and the entire board package ceramic substrate is divided into several bar-shaped ceramic substrate regions taking as single-stripe filament solid crystal bonding wire pedestal. The entire board package ceramic substrate is fixed on a metal rack at one time, the technology is simplified, and the yield is greatly improved. Compared with a traditional LED filament, the flatness and the stability of the entire board package ceramic substrate fixed on the metal rack is improved while the yield is improved, so that the substrate excursion caused by human influence and the different flatness phenomenon caused by different intensities are greatly reduced in the manual disposing process, the yield of the program is improved, the time required by the process is shortened, and the product cost is reduced. The subsequent operatio
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Entire board package ceramic LED lamp filament and processing method thereof
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