LED fluorescent glue and packaging method for improving luminescence uniformity, and LED
The invention discloses LED fluorescent glue for improving luminescence uniformity. The fluorescent glue is composed of 1 part of packaging glue, 0.01-1 part of fluorescent powder, 0.01-0.1 part of a silicon dioxide inorganic nanometer particle and 0.01-1 part of an organic silicon particle in parts...
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| creator | Guo Yuan Gong Tao Tong Wenpeng Ma Minglai Zhang Zhikuan |
| description | The invention discloses LED fluorescent glue for improving luminescence uniformity. The fluorescent glue is composed of 1 part of packaging glue, 0.01-1 part of fluorescent powder, 0.01-0.1 part of a silicon dioxide inorganic nanometer particle and 0.01-1 part of an organic silicon particle in parts by weight. An inorganic nanometer material and the organic silicon particles are mixed into the packaging glue, the settlement rate of the fluorescent powder in the packaging glue is reduced, the distribution uniformity of the fluorescent powder in a colloid is improved, light spots of white light are more uniform, the diffusivity of light and the light transmittance are maximized, through changing the propagation path of the light, the light with various wave lengths can be mixed more fully, and the space color uniformity of the light is further improved. The invention further discloses an LED packaging method for improving luminescence uniformity and an LED. According to the invention, the product consistency is |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN105845812A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN105845812A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN105845812A3</originalsourceid><addsrcrecordid>eNrjZIjwcXVRSMspzS9KLU5OzStRSM8pTVVIzEtRKEhMzk5Mz8xLV8hNLcnIT1FIyy9SyMwtKMovAwnmlOZm5oH1JKcqlOZlAmVzM0sqdcB6gYbyMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjUYqDpqXmpJfHOfoYGphYmphaGRo7GxKgBAGQPOc8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LED fluorescent glue and packaging method for improving luminescence uniformity, and LED</title><source>esp@cenet</source><creator>Guo Yuan ; Gong Tao ; Tong Wenpeng ; Ma Minglai ; Zhang Zhikuan</creator><creatorcontrib>Guo Yuan ; Gong Tao ; Tong Wenpeng ; Ma Minglai ; Zhang Zhikuan</creatorcontrib><description>The invention discloses LED fluorescent glue for improving luminescence uniformity. The fluorescent glue is composed of 1 part of packaging glue, 0.01-1 part of fluorescent powder, 0.01-0.1 part of a silicon dioxide inorganic nanometer particle and 0.01-1 part of an organic silicon particle in parts by weight. An inorganic nanometer material and the organic silicon particles are mixed into the packaging glue, the settlement rate of the fluorescent powder in the packaging glue is reduced, the distribution uniformity of the fluorescent powder in a colloid is improved, light spots of white light are more uniform, the diffusivity of light and the light transmittance are maximized, through changing the propagation path of the light, the light with various wave lengths can be mixed more fully, and the space color uniformity of the light is further improved. The invention further discloses an LED packaging method for improving luminescence uniformity and an LED. According to the invention, the product consistency is</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160810&DB=EPODOC&CC=CN&NR=105845812A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160810&DB=EPODOC&CC=CN&NR=105845812A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Guo Yuan</creatorcontrib><creatorcontrib>Gong Tao</creatorcontrib><creatorcontrib>Tong Wenpeng</creatorcontrib><creatorcontrib>Ma Minglai</creatorcontrib><creatorcontrib>Zhang Zhikuan</creatorcontrib><title>LED fluorescent glue and packaging method for improving luminescence uniformity, and LED</title><description>The invention discloses LED fluorescent glue for improving luminescence uniformity. The fluorescent glue is composed of 1 part of packaging glue, 0.01-1 part of fluorescent powder, 0.01-0.1 part of a silicon dioxide inorganic nanometer particle and 0.01-1 part of an organic silicon particle in parts by weight. An inorganic nanometer material and the organic silicon particles are mixed into the packaging glue, the settlement rate of the fluorescent powder in the packaging glue is reduced, the distribution uniformity of the fluorescent powder in a colloid is improved, light spots of white light are more uniform, the diffusivity of light and the light transmittance are maximized, through changing the propagation path of the light, the light with various wave lengths can be mixed more fully, and the space color uniformity of the light is further improved. The invention further discloses an LED packaging method for improving luminescence uniformity and an LED. According to the invention, the product consistency is</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjwcXVRSMspzS9KLU5OzStRSM8pTVVIzEtRKEhMzk5Mz8xLV8hNLcnIT1FIyy9SyMwtKMovAwnmlOZm5oH1JKcqlOZlAmVzM0sqdcB6gYbyMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjUYqDpqXmpJfHOfoYGphYmphaGRo7GxKgBAGQPOc8</recordid><startdate>20160810</startdate><enddate>20160810</enddate><creator>Guo Yuan</creator><creator>Gong Tao</creator><creator>Tong Wenpeng</creator><creator>Ma Minglai</creator><creator>Zhang Zhikuan</creator><scope>EVB</scope></search><sort><creationdate>20160810</creationdate><title>LED fluorescent glue and packaging method for improving luminescence uniformity, and LED</title><author>Guo Yuan ; Gong Tao ; Tong Wenpeng ; Ma Minglai ; Zhang Zhikuan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105845812A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Guo Yuan</creatorcontrib><creatorcontrib>Gong Tao</creatorcontrib><creatorcontrib>Tong Wenpeng</creatorcontrib><creatorcontrib>Ma Minglai</creatorcontrib><creatorcontrib>Zhang Zhikuan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Guo Yuan</au><au>Gong Tao</au><au>Tong Wenpeng</au><au>Ma Minglai</au><au>Zhang Zhikuan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED fluorescent glue and packaging method for improving luminescence uniformity, and LED</title><date>2016-08-10</date><risdate>2016</risdate><abstract>The invention discloses LED fluorescent glue for improving luminescence uniformity. The fluorescent glue is composed of 1 part of packaging glue, 0.01-1 part of fluorescent powder, 0.01-0.1 part of a silicon dioxide inorganic nanometer particle and 0.01-1 part of an organic silicon particle in parts by weight. An inorganic nanometer material and the organic silicon particles are mixed into the packaging glue, the settlement rate of the fluorescent powder in the packaging glue is reduced, the distribution uniformity of the fluorescent powder in a colloid is improved, light spots of white light are more uniform, the diffusivity of light and the light transmittance are maximized, through changing the propagation path of the light, the light with various wave lengths can be mixed more fully, and the space color uniformity of the light is further improved. The invention further discloses an LED packaging method for improving luminescence uniformity and an LED. According to the invention, the product consistency is</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LED fluorescent glue and packaging method for improving luminescence uniformity, and LED |
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