Mechanical quantity measuring device and sensor unit
A mechanical quantity measuring device is provided with a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector, a stem having a base that protrudes from an adjacent peripheral portion and has an upper sur...
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| creator | Yamaguchi Takuto Oota Hiroyuki Ashida Kisho Miyajima Kentarou Hio Masayuki Shimokawa Hanae Soma Atsuo Kazama Atsushi Hata Shohei Onozuka Junji |
| description | A mechanical quantity measuring device is provided with a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector, a stem having a base that protrudes from an adjacent peripheral portion and has an upper surface that is attached to the lower surface of the sensor chip by a bonding material formed from a metallic or glass material, a lead-out wiring part provided with a plurality of wires that are electrically connected to the plurality of electrodes, and a fixing part for fixing the stem. The stem and fixing part are integrally formed or fixed through metallic bonding or mechanical bonding.
力学量测量装置，其具备：传感器片，其具有形成于半导体基板的面的应变检测部和与应变检测部连接的多个电极；茎部，其具有从邻接的周缘部突出的台座，并且台座的上表面通过由金属材料或玻璃材料形成的接合件与传感器片的下表面接合；引出配线部，其具备与多个电极电连接的多个配线；以及固定部，其固定茎部，茎部与固定部通过体成形、金属接合或机械结合而被固定。 |
| format | Patent |
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力学量测量装置，其具备：传感器片，其具有形成于半导体基板的面的应变检测部和与应变检测部连接的多个电极；茎部，其具有从邻接的周缘部突出的台座，并且台座的上表面通过由金属材料或玻璃材料形成的接合件与传感器片的下表面接合；引出配线部，其具备与多个电极电连接的多个配线；以及固定部，其固定茎部，茎部与固定部通过体成形、金属接合或机械结合而被固定。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160803&DB=EPODOC&CC=CN&NR=105829851A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160803&DB=EPODOC&CC=CN&NR=105829851A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yamaguchi Takuto</creatorcontrib><creatorcontrib>Oota Hiroyuki</creatorcontrib><creatorcontrib>Ashida Kisho</creatorcontrib><creatorcontrib>Miyajima Kentarou</creatorcontrib><creatorcontrib>Hio Masayuki</creatorcontrib><creatorcontrib>Shimokawa Hanae</creatorcontrib><creatorcontrib>Soma Atsuo</creatorcontrib><creatorcontrib>Kazama Atsushi</creatorcontrib><creatorcontrib>Hata Shohei</creatorcontrib><creatorcontrib>Onozuka Junji</creatorcontrib><title>Mechanical quantity measuring device and sensor unit</title><description>A mechanical quantity measuring device is provided with a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector, a stem having a base that protrudes from an adjacent peripheral portion and has an upper surface that is attached to the lower surface of the sensor chip by a bonding material formed from a metallic or glass material, a lead-out wiring part provided with a plurality of wires that are electrically connected to the plurality of electrodes, and a fixing part for fixing the stem. The stem and fixing part are integrally formed or fixed through metallic bonding or mechanical bonding.
力学量测量装置，其具备：传感器片，其具有形成于半导体基板的面的应变检测部和与应变检测部连接的多个电极；茎部，其具有从邻接的周缘部突出的台座，并且台座的上表面通过由金属材料或玻璃材料形成的接合件与传感器片的下表面接合；引出配线部，其具备与多个电极电连接的多个配线；以及固定部，其固定茎部，茎部与固定部通过体成形、金属接合或机械结合而被固定。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxTU3OSMzLTE7MUSgsTcwrySypVMhNTSwuLcrMS1dISS3LTE5VSMxLUShOzSvOL1Iozcss4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgamFkaWFqaGjsbEqAEAUPktFQ</recordid><startdate>20160803</startdate><enddate>20160803</enddate><creator>Yamaguchi Takuto</creator><creator>Oota Hiroyuki</creator><creator>Ashida Kisho</creator><creator>Miyajima Kentarou</creator><creator>Hio Masayuki</creator><creator>Shimokawa Hanae</creator><creator>Soma Atsuo</creator><creator>Kazama Atsushi</creator><creator>Hata Shohei</creator><creator>Onozuka Junji</creator><scope>EVB</scope></search><sort><creationdate>20160803</creationdate><title>Mechanical quantity measuring device and sensor unit</title><author>Yamaguchi Takuto ; Oota Hiroyuki ; Ashida Kisho ; Miyajima Kentarou ; Hio Masayuki ; Shimokawa Hanae ; Soma Atsuo ; Kazama Atsushi ; Hata Shohei ; Onozuka Junji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105829851A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Yamaguchi Takuto</creatorcontrib><creatorcontrib>Oota Hiroyuki</creatorcontrib><creatorcontrib>Ashida Kisho</creatorcontrib><creatorcontrib>Miyajima Kentarou</creatorcontrib><creatorcontrib>Hio Masayuki</creatorcontrib><creatorcontrib>Shimokawa Hanae</creatorcontrib><creatorcontrib>Soma Atsuo</creatorcontrib><creatorcontrib>Kazama Atsushi</creatorcontrib><creatorcontrib>Hata Shohei</creatorcontrib><creatorcontrib>Onozuka Junji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yamaguchi Takuto</au><au>Oota Hiroyuki</au><au>Ashida Kisho</au><au>Miyajima Kentarou</au><au>Hio Masayuki</au><au>Shimokawa Hanae</au><au>Soma Atsuo</au><au>Kazama Atsushi</au><au>Hata Shohei</au><au>Onozuka Junji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mechanical quantity measuring device and sensor unit</title><date>2016-08-03</date><risdate>2016</risdate><abstract>A mechanical quantity measuring device is provided with a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector, a stem having a base that protrudes from an adjacent peripheral portion and has an upper surface that is attached to the lower surface of the sensor chip by a bonding material formed from a metallic or glass material, a lead-out wiring part provided with a plurality of wires that are electrically connected to the plurality of electrodes, and a fixing part for fixing the stem. The stem and fixing part are integrally formed or fixed through metallic bonding or mechanical bonding.
力学量测量装置，其具备：传感器片，其具有形成于半导体基板的面的应变检测部和与应变检测部连接的多个电极；茎部，其具有从邻接的周缘部突出的台座，并且台座的上表面通过由金属材料或玻璃材料形成的接合件与传感器片的下表面接合；引出配线部，其具备与多个电极电连接的多个配线；以及固定部，其固定茎部，茎部与固定部通过体成形、金属接合或机械结合而被固定。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Mechanical quantity measuring device and sensor unit |
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