Method for handling a product substrate, a bonded substrate system and a temporary adhesive
A method for handling a product substrate includes a step of bonding a carrier to the product substrate, applying a layer of a permanent adhesive onto a surface of the carrier, and providing a structured intermediate layer, wherein the applied permanent adhesive bonds the carrier to the product subs...
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| creator | DOMINIC MAIER CLAUS VON WAECHTER TOBIAS SCHMIDT GEORG MEYER-BERG DANIEL PORWOL MICHAEL BAUER HOLGER DOEPKE |
| description | A method for handling a product substrate includes a step of bonding a carrier to the product substrate, applying a layer of a permanent adhesive onto a surface of the carrier, and providing a structured intermediate layer, wherein the applied permanent adhesive bonds the carrier to the product substrate, the structured intermediate layer is arranged between the product substrate and the carrier, and a surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier..
种用于处理产品衬底的方法包括将承载体粘结至产品衬底。将永久性粘合剂的层施加到承载体的表面上。提供结构化的中间层。所施加的永久性粘合剂将承载体粘结至产品衬底。结构化的中间层布置在产品衬底与承载体之间。结构化的中间层的表面和永久性粘合剂的表面与产品衬底的表面直接接触。结构化的中间层减小产品衬底与承载体之间的粘合强度。 |
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种用于处理产品衬底的方法包括将承载体粘结至产品衬底。将永久性粘合剂的层施加到承载体的表面上。提供结构化的中间层。所施加的永久性粘合剂将承载体粘结至产品衬底。结构化的中间层布置在产品衬底与承载体之间。结构化的中间层的表面和永久性粘合剂的表面与产品衬底的表面直接接触。结构化的中间层减小产品衬底与承载体之间的粘合强度。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160727&DB=EPODOC&CC=CN&NR=105810595A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160727&DB=EPODOC&CC=CN&NR=105810595A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DOMINIC MAIER</creatorcontrib><creatorcontrib>CLAUS VON WAECHTER</creatorcontrib><creatorcontrib>TOBIAS SCHMIDT</creatorcontrib><creatorcontrib>GEORG MEYER-BERG</creatorcontrib><creatorcontrib>DANIEL PORWOL</creatorcontrib><creatorcontrib>MICHAEL BAUER</creatorcontrib><creatorcontrib>HOLGER DOEPKE</creatorcontrib><title>Method for handling a product substrate, a bonded substrate system and a temporary adhesive</title><description>A method for handling a product substrate includes a step of bonding a carrier to the product substrate, applying a layer of a permanent adhesive onto a surface of the carrier, and providing a structured intermediate layer, wherein the applied permanent adhesive bonds the carrier to the product substrate, the structured intermediate layer is arranged between the product substrate and the carrier, and a surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier..
种用于处理产品衬底的方法包括将承载体粘结至产品衬底。将永久性粘合剂的层施加到承载体的表面上。提供结构化的中间层。所施加的永久性粘合剂将承载体粘结至产品衬底。结构化的中间层布置在产品衬底与承载体之间。结构化的中间层的表面和永久性粘合剂的表面与产品衬底的表面直接接触。结构化的中间层减小产品衬底与承载体之间的粘合强度。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj2TS3JyE9RSMsvUshIzEvJycxLV0hUKCjKTylNLlEoLk0qLilKLEnVAQom5eelpKYgxBSKK4tLUnMVgNqAskBWQX5RYlGlQmJKRmpxZlkqDwNrWmJOcSovlOZmUHRzDXH20E0tyI9PLS5ITE7NSy2Jd_YzNDC1AGJLU0djYtQAAEvXO00</recordid><startdate>20160727</startdate><enddate>20160727</enddate><creator>DOMINIC MAIER</creator><creator>CLAUS VON WAECHTER</creator><creator>TOBIAS SCHMIDT</creator><creator>GEORG MEYER-BERG</creator><creator>DANIEL PORWOL</creator><creator>MICHAEL BAUER</creator><creator>HOLGER DOEPKE</creator><scope>EVB</scope></search><sort><creationdate>20160727</creationdate><title>Method for handling a product substrate, a bonded substrate system and a temporary adhesive</title><author>DOMINIC MAIER ; CLAUS VON WAECHTER ; TOBIAS SCHMIDT ; GEORG MEYER-BERG ; DANIEL PORWOL ; MICHAEL BAUER ; HOLGER DOEPKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105810595A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>DOMINIC MAIER</creatorcontrib><creatorcontrib>CLAUS VON WAECHTER</creatorcontrib><creatorcontrib>TOBIAS SCHMIDT</creatorcontrib><creatorcontrib>GEORG MEYER-BERG</creatorcontrib><creatorcontrib>DANIEL PORWOL</creatorcontrib><creatorcontrib>MICHAEL BAUER</creatorcontrib><creatorcontrib>HOLGER DOEPKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DOMINIC MAIER</au><au>CLAUS VON WAECHTER</au><au>TOBIAS SCHMIDT</au><au>GEORG MEYER-BERG</au><au>DANIEL PORWOL</au><au>MICHAEL BAUER</au><au>HOLGER DOEPKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for handling a product substrate, a bonded substrate system and a temporary adhesive</title><date>2016-07-27</date><risdate>2016</risdate><abstract>A method for handling a product substrate includes a step of bonding a carrier to the product substrate, applying a layer of a permanent adhesive onto a surface of the carrier, and providing a structured intermediate layer, wherein the applied permanent adhesive bonds the carrier to the product substrate, the structured intermediate layer is arranged between the product substrate and the carrier, and a surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier..
种用于处理产品衬底的方法包括将承载体粘结至产品衬底。将永久性粘合剂的层施加到承载体的表面上。提供结构化的中间层。所施加的永久性粘合剂将承载体粘结至产品衬底。结构化的中间层布置在产品衬底与承载体之间。结构化的中间层的表面和永久性粘合剂的表面与产品衬底的表面直接接触。结构化的中间层减小产品衬底与承载体之间的粘合强度。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Method for handling a product substrate, a bonded substrate system and a temporary adhesive |
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