Wafer Taping

The invention relates to a wafer taping. A method for applying tape to a substrate can include positioning a tape proximate and substantially parallel to a surface of a substrate. A pressure source can be configured to apply pressure to a region of tape smaller than the surface in both an x directio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BIRKMEYER JEFFREY, DEMING STEVE, BIBL ANDREAS, SCHNEIDER DAVID W
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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