Wafer tray, jig for assembling wafer tray and method for assembling wafer tray
The invention relates to a wafer tray, a jig for assembling the wafer tray and a method for assembling the wafer tray. The wafer tray comprises an upper tray and a lower tray. After a wafer is placed, the lower tray and the upper tray are assembled from a bottom surface of the lower tray. The invent...
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| creator | CHOI MIN-HO KONG CHAEL-WU CHANG TONG-HYEUN SIN HWAN-OOK HONG SA-IN YOO JONG-HYUN PARK JONGAN |
| description | The invention relates to a wafer tray, a jig for assembling the wafer tray and a method for assembling the wafer tray. The wafer tray comprises an upper tray and a lower tray. After a wafer is placed, the lower tray and the upper tray are assembled from a bottom surface of the lower tray. The invention provides a jig for assembling a wafer tray, the wafer tray comprises the upper tray and a lower tray, the lower tray comprises a wafer loading part on which a wafer is placed, and the upper tray is connected to the lower tray in a manner that the wafer is exposed through a wafer exposure opening, wherein a fixing bolt is connected to the upper tray through a bottom surface of the lower tray. The jig comprises a jig base which comprises a base opening with a vertical opening and on which the lower tray is placed, and an upper cover connected to the jig base. and, after the wafer is placed on the wafer loading part of the lower tray, in a state that the upper tray is placed on the lower tray, and upper part of th |
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The wafer tray comprises an upper tray and a lower tray. After a wafer is placed, the lower tray and the upper tray are assembled from a bottom surface of the lower tray. The invention provides a jig for assembling a wafer tray, the wafer tray comprises the upper tray and a lower tray, the lower tray comprises a wafer loading part on which a wafer is placed, and the upper tray is connected to the lower tray in a manner that the wafer is exposed through a wafer exposure opening, wherein a fixing bolt is connected to the upper tray through a bottom surface of the lower tray. 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The jig comprises a jig base which comprises a base opening with a vertical opening and on which the lower tray is placed, and an upper cover connected to the jig base. and, after the wafer is placed on the wafer loading part of the lower tray, in a state that the upper tray is placed on the lower tray, and upper part of th</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPALT0xLLVIoKUqs1FHIykxXSMsvUkgsLk7NTcrJzEtXKIdLKyTmpSjkppZk5KfgVsTDwJqWmFOcyguluRkU3VxDnD10Uwvy41OLCxKTU_NSS-Kd_QwNTE1NjQwMLByNiVEDAMaUNfo</recordid><startdate>20160504</startdate><enddate>20160504</enddate><creator>CHOI MIN-HO</creator><creator>KONG CHAEL-WU</creator><creator>CHANG TONG-HYEUN</creator><creator>SIN HWAN-OOK</creator><creator>HONG SA-IN</creator><creator>YOO JONG-HYUN</creator><creator>PARK JONGAN</creator><scope>EVB</scope></search><sort><creationdate>20160504</creationdate><title>Wafer tray, jig for assembling wafer tray and method for assembling wafer tray</title><author>CHOI MIN-HO ; KONG CHAEL-WU ; CHANG TONG-HYEUN ; SIN HWAN-OOK ; HONG SA-IN ; YOO JONG-HYUN ; PARK JONGAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105552008A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI MIN-HO</creatorcontrib><creatorcontrib>KONG CHAEL-WU</creatorcontrib><creatorcontrib>CHANG TONG-HYEUN</creatorcontrib><creatorcontrib>SIN HWAN-OOK</creatorcontrib><creatorcontrib>HONG SA-IN</creatorcontrib><creatorcontrib>YOO JONG-HYUN</creatorcontrib><creatorcontrib>PARK JONGAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI MIN-HO</au><au>KONG CHAEL-WU</au><au>CHANG TONG-HYEUN</au><au>SIN HWAN-OOK</au><au>HONG SA-IN</au><au>YOO JONG-HYUN</au><au>PARK JONGAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer tray, jig for assembling wafer tray and method for assembling wafer tray</title><date>2016-05-04</date><risdate>2016</risdate><abstract>The invention relates to a wafer tray, a jig for assembling the wafer tray and a method for assembling the wafer tray. The wafer tray comprises an upper tray and a lower tray. After a wafer is placed, the lower tray and the upper tray are assembled from a bottom surface of the lower tray. The invention provides a jig for assembling a wafer tray, the wafer tray comprises the upper tray and a lower tray, the lower tray comprises a wafer loading part on which a wafer is placed, and the upper tray is connected to the lower tray in a manner that the wafer is exposed through a wafer exposure opening, wherein a fixing bolt is connected to the upper tray through a bottom surface of the lower tray. The jig comprises a jig base which comprises a base opening with a vertical opening and on which the lower tray is placed, and an upper cover connected to the jig base. and, after the wafer is placed on the wafer loading part of the lower tray, in a state that the upper tray is placed on the lower tray, and upper part of th</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Wafer tray, jig for assembling wafer tray and method for assembling wafer tray |
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