Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices

Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler mater...

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Bibliographische Detailangaben
Hauptverfasser:	GALLINA MARK, HEMMEYER MARK, STEWART MICHAEL, PIDWERBECKI DAVID, BYRD KEVIN, APPL INV LOFLAND STEVEN, ILAVARASAN PONNIAH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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