Holding tool and method for tinning of VMOS chip tin pot for satellite

The invention discloses a holding tool and method for the tinning of a VMOS chip tin pot for a satellite, and the tool comprises a chip flange tray, a positioning piece, a positioning piece card slot, and a holding tool handle. The positioning piece is installed on the tray through a positioning pie...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MA LI, CAO XIDAN, DING LIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a holding tool and method for the tinning of a VMOS chip tin pot for a satellite, and the tool comprises a chip flange tray, a positioning piece, a positioning piece card slot, and a holding tool handle. The positioning piece is installed on the tray through a positioning piece card slot. After a to-be-tinned chip bonding pad is disposed on the positioning piece, the bonding pad is completely aligned with an opening slot of the positioning piece. The designed tool achieves the tinning technology of the VMOS chip tin pot for the satellite. Compared with a manual soldering iron tinning mode, the method is more precise in temperature control, is more flat in a pin tinning place, and greatly improves the mounting accuracy of chip equipment after the tinning technology.