leadframe strip with sawing enhancement feature

The invention relates to a leadframe strip with a sawing enhancement feature. The leadframe strip includes a plurality of leads chemically etched into a metal sheet, a plurality of support structures chemically etched into the metal sheet, and a plurality of connecting structures chemically etched i...

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Hauptverfasser: THIONG ZHOU SEE, LAY YEAP LIM, CHIEW LI TAI, WAE CHET YONG, WEE BOON TAY
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Sprache:chi ; eng
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creator THIONG ZHOU SEE
LAY YEAP LIM
CHIEW LI TAI
WAE CHET YONG
WEE BOON TAY
description The invention relates to a leadframe strip with a sawing enhancement feature. The leadframe strip includes a plurality of leads chemically etched into a metal sheet, a plurality of support structures chemically etched into the metal sheet, and a plurality of connecting structures chemically etched into the metal sheet. Each of the connecting structures is integrally connected at a first end to one of the leads and integrally connected at a second end to one of the support structures so that the leads are held in place by the support structures. The width of each connecting structure is at a minimum between the first and second ends of that connecting structure, increases from the minimum in a direction toward the first end, and increases from the minimum in a direction toward the second end. A method of manufacturing such a leadframe strip is also provided.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title leadframe strip with sawing enhancement feature
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