Production method capable of removing turning burrs of PI (polyimide) dielectric layer of aluminum substrate

The invention relates to a production method capable of removing turning burrs of a PI (polyimide) dielectric layer of an aluminum substrate. The method comprises the following steps: (1) producing a flexible aluminum substrate; (2) attaching a protective film to a circuit surface of the aluminum substrate; (3) producing a turning belt by facing an engineering data mirror circuit surface downwards; (4) placing a piece of kraft paper on a board backing plate of a turning machine work table; (5) tightly attaching the circuit surface of the aluminum substrate to the kraft paper on the board backing plate for arrangement of turning; (6) tearing off the protective film on the circuit surface of the aluminum substrate after turning; the turned aluminum-based board finished product is the burr-free PI dielectric layer product. According to the method, the medium-viscosity protective film is attached to the circuit surface of the flexible aluminum substrate and the circuit surface is downwards tightly attached to the board backing plate of the work table for turning, so that the processed flexible aluminum substrate PI dielectric layer is free of turning burrs, and the flexible aluminum substrate turning quality is improved greatly.