In mold electronic printed circuit board encapsulation and assembly

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSCO MARK, ROCCO DAVID, DUNAY KEVIN, LORENZO JAMES, DAVIS TERRY G, SUNDERLAND NICOLAS, SAGAL MIKHAIL, MCCANNA JESSEE
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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