Metal-based mounting board and member provided with metal-based mounting board

Metal-based mounting board and member provided with metal-based mounting board

A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provid...

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Hauptverfasser: YOSHIHIDE NII, YUKIHARU YUZURIHA, TOSHIO KOMIYATANI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator YOSHIHIDE NII
YUKIHARU YUZURIHA
TOSHIO KOMIYATANI
description A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45 DEG or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN105321898A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN105321898A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN105321898A3</originalsourceid><addsrcrecordid>eNrjZPDzTS1JzNFNSixOTVHIzS_NK8nMS1dIyk8sSlFIzAMKpeYmpRYpFBTll2WmAJWUZ5ZkAAVx6eFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGpsZGhhaWFo7GxKgBAAJ4NnM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Metal-based mounting board and member provided with metal-based mounting board</title><source>esp@cenet</source><creator>YOSHIHIDE NII ; YUKIHARU YUZURIHA ; TOSHIO KOMIYATANI</creator><creatorcontrib>YOSHIHIDE NII ; YUKIHARU YUZURIHA ; TOSHIO KOMIYATANI</creatorcontrib><description>A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45 DEG or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160210&amp;DB=EPODOC&amp;CC=CN&amp;NR=105321898A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160210&amp;DB=EPODOC&amp;CC=CN&amp;NR=105321898A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIHIDE NII</creatorcontrib><creatorcontrib>YUKIHARU YUZURIHA</creatorcontrib><creatorcontrib>TOSHIO KOMIYATANI</creatorcontrib><title>Metal-based mounting board and member provided with metal-based mounting board</title><description>A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45 DEG or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDzTS1JzNFNSixOTVHIzS_NK8nMS1dIyk8sSlFIzAMKpeYmpRYpFBTll2WmAJWUZ5ZkAAVx6eFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGpsZGhhaWFo7GxKgBAAJ4NnM</recordid><startdate>20160210</startdate><enddate>20160210</enddate><creator>YOSHIHIDE NII</creator><creator>YUKIHARU YUZURIHA</creator><creator>TOSHIO KOMIYATANI</creator><scope>EVB</scope></search><sort><creationdate>20160210</creationdate><title>Metal-based mounting board and member provided with metal-based mounting board</title><author>YOSHIHIDE NII ; YUKIHARU YUZURIHA ; TOSHIO KOMIYATANI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105321898A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIHIDE NII</creatorcontrib><creatorcontrib>YUKIHARU YUZURIHA</creatorcontrib><creatorcontrib>TOSHIO KOMIYATANI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIHIDE NII</au><au>YUKIHARU YUZURIHA</au><au>TOSHIO KOMIYATANI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metal-based mounting board and member provided with metal-based mounting board</title><date>2016-02-10</date><risdate>2016</risdate><abstract>A metal-based mounting board according to the present invention includes: a metal-based circuit board including a metal substrate having a first surface and a second surface opposite to the first surface, an insulating film provided on the first surface of the metal substrate and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board, wherein in the case where within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45 DEG or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region, and a region other than the first region is defined as a second region, a groove is provided within the second region, but is not provided within the first region.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Metal-based mounting board and member provided with metal-based mounting board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T21%3A06%3A08IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOSHIHIDE%20NII&rft.date=2016-02-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN105321898A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true