Method and device for cutting substrate
The invention discloses a method and a device for cutting a substrate. The method comprises steps of performing correction on the position deviation between before and after cutting on a block area which is cut out from a formed substrate, performing detection and comparison on the second alignment...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention discloses a method and a device for cutting a substrate. The method comprises steps of performing correction on the position deviation between before and after cutting on a block area which is cut out from a formed substrate, performing detection and comparison on the second alignment mark (1f) before and after the cutting process after presetting the second alignment mark (1f) on the block area (1c) of the formed substrate, and performing correction on the block area (1c) position. |
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