Packaging structure and manufacturing process of micro electro mechanical system sensing device

The invention relates to a packaging structure and a manufacturing process of a micro electro mechanical system sensing device. The packaging structure comprises a substrate, a chip, a first sensing bare chip, a second sensing bare chip and a sealing compound. The chip is arranged on a first surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI SHUOYUAN, KANG CHENGGUO, LI JINGXIE, LI SHENGMAO, LIN BINGJUN, JIN ZHU, JIN XIYAN
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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