Packaging structure and manufacturing process of micro electro mechanical system sensing device
The invention relates to a packaging structure and a manufacturing process of a micro electro mechanical system sensing device. The packaging structure comprises a substrate, a chip, a first sensing bare chip, a second sensing bare chip and a sealing compound. The chip is arranged on a first surface...
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| creator | LI SHUOYUAN KANG CHENGGUO LI JINGXIE LI SHENGMAO LIN BINGJUN JIN ZHU JIN XIYAN |
| description | The invention relates to a packaging structure and a manufacturing process of a micro electro mechanical system sensing device. The packaging structure comprises a substrate, a chip, a first sensing bare chip, a second sensing bare chip and a sealing compound. The chip is arranged on a first surface of the substrate. The first sensing bare chip is electrically connected with the chip. The second sensing bare chip is stacked on the first surface of the chip, and the second sensing bare chip is electrically connected with the chip. The sealing compound coats the first surface of the substrate, a part of the first surface of the chip and the first sensing bare chip, wherein the sealing compound forms a notch to expose the second sensing bare chip. The packaging structure can reduce the package size and improve the electrical characteristics. |
| format | Patent |
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| subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
| title | Packaging structure and manufacturing process of micro electro mechanical system sensing device |
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