Packaging structure and manufacture method of LED module

Packaging structure and manufacture method of LED module

The invention discloses a packaging structure and a manufacture method of an LED module. The manufacture method comprises that a light emitting module is provided, a light transmission member of a transport structure is arranged in the light emitting path of the light emitting module, at least one g...

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Hauptverfasser: XINGN ZHENLUN, CAI FENGQUAN, HONG RONGHAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator XINGN ZHENLUN
CAI FENGQUAN
HONG RONGHAO
description The invention discloses a packaging structure and a manufacture method of an LED module. The manufacture method comprises that a light emitting module is provided, a light transmission member of a transport structure is arranged in the light emitting path of the light emitting module, at least one glue member is arranged on the light transmission member by dropping, and the glue member forms a transparent structure which is thick in the middle and thin in the periphery due to the surface tension of a glue material. Both the light transmission member and the glue member are of the transparent structures, so that the total reflection effect generated by packaging is reduced.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN105280758A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN105280758A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN105280758A3</originalsourceid><addsrcrecordid>eNrjZLAISEzOTkzPzEtXKC4pKk0uKS1KVUjMS1HITcwrTUuE8HNTSzLyUxTy0xR8XF0UcvNTSnNSeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGpkYWBuamFozExagDxKC38</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Packaging structure and manufacture method of LED module</title><source>esp@cenet</source><creator>XINGN ZHENLUN ; CAI FENGQUAN ; HONG RONGHAO</creator><creatorcontrib>XINGN ZHENLUN ; CAI FENGQUAN ; HONG RONGHAO</creatorcontrib><description>The invention discloses a packaging structure and a manufacture method of an LED module. The manufacture method comprises that a light emitting module is provided, a light transmission member of a transport structure is arranged in the light emitting path of the light emitting module, at least one glue member is arranged on the light transmission member by dropping, and the glue member forms a transparent structure which is thick in the middle and thin in the periphery due to the surface tension of a glue material. Both the light transmission member and the glue member are of the transparent structures, so that the total reflection effect generated by packaging is reduced.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160127&amp;DB=EPODOC&amp;CC=CN&amp;NR=105280758A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160127&amp;DB=EPODOC&amp;CC=CN&amp;NR=105280758A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XINGN ZHENLUN</creatorcontrib><creatorcontrib>CAI FENGQUAN</creatorcontrib><creatorcontrib>HONG RONGHAO</creatorcontrib><title>Packaging structure and manufacture method of LED module</title><description>The invention discloses a packaging structure and a manufacture method of an LED module. The manufacture method comprises that a light emitting module is provided, a light transmission member of a transport structure is arranged in the light emitting path of the light emitting module, at least one glue member is arranged on the light transmission member by dropping, and the glue member forms a transparent structure which is thick in the middle and thin in the periphery due to the surface tension of a glue material. Both the light transmission member and the glue member are of the transparent structures, so that the total reflection effect generated by packaging is reduced.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAISEzOTkzPzEtXKC4pKk0uKS1KVUjMS1HITcwrTUuE8HNTSzLyUxTy0xR8XF0UcvNTSnNSeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGpkYWBuamFozExagDxKC38</recordid><startdate>20160127</startdate><enddate>20160127</enddate><creator>XINGN ZHENLUN</creator><creator>CAI FENGQUAN</creator><creator>HONG RONGHAO</creator><scope>EVB</scope></search><sort><creationdate>20160127</creationdate><title>Packaging structure and manufacture method of LED module</title><author>XINGN ZHENLUN ; CAI FENGQUAN ; HONG RONGHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105280758A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>XINGN ZHENLUN</creatorcontrib><creatorcontrib>CAI FENGQUAN</creatorcontrib><creatorcontrib>HONG RONGHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XINGN ZHENLUN</au><au>CAI FENGQUAN</au><au>HONG RONGHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging structure and manufacture method of LED module</title><date>2016-01-27</date><risdate>2016</risdate><abstract>The invention discloses a packaging structure and a manufacture method of an LED module. The manufacture method comprises that a light emitting module is provided, a light transmission member of a transport structure is arranged in the light emitting path of the light emitting module, at least one glue member is arranged on the light transmission member by dropping, and the glue member forms a transparent structure which is thick in the middle and thin in the periphery due to the surface tension of a glue material. Both the light transmission member and the glue member are of the transparent structures, so that the total reflection effect generated by packaging is reduced.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Packaging structure and manufacture method of LED module
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T14%3A21%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=XINGN%20ZHENLUN&rft.date=2016-01-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN105280758A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true