Chip-on-film structure and liquid crystal panel provided with same
The invention provides a chip-on-film structure. The structure comprises a film and a driving chip, wherein a set of input end leads and a set of output end leads are arranged on the film, a binding part is formed at the tail end of each output end lead, and the driving chip is arranged on the film...
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| creator | SONG HAIMAN GUO DONGSHENG |
| description | The invention provides a chip-on-film structure. The structure comprises a film and a driving chip, wherein a set of input end leads and a set of output end leads are arranged on the film, a binding part is formed at the tail end of each output end lead, and the driving chip is arranged on the film and electrically connected to the input end leads and the output end leads. The position, connected with the tail end of the corresponding output end lead, of each binding part is defined as A, the position, away from the tail end of the corresponding output end lead, of each binding part is defined as B, the distance between A and B is L, and the area of each binding part is larger than that of the corresponding output end lead under the length L. According to the chip-on-film structure, binding yield can be increased, and manufacturing cost can be reduced. The invention further provides a liquid crystal panel provided with the chip-on-film structure. |
| format | Patent |
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The structure comprises a film and a driving chip, wherein a set of input end leads and a set of output end leads are arranged on the film, a binding part is formed at the tail end of each output end lead, and the driving chip is arranged on the film and electrically connected to the input end leads and the output end leads. The position, connected with the tail end of the corresponding output end lead, of each binding part is defined as A, the position, away from the tail end of the corresponding output end lead, of each binding part is defined as B, the distance between A and B is L, and the area of each binding part is larger than that of the corresponding output end lead under the length L. According to the chip-on-film structure, binding yield can be increased, and manufacturing cost can be reduced. The invention further provides a liquid crystal panel provided with the chip-on-film structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160120&DB=EPODOC&CC=CN&NR=105259718A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160120&DB=EPODOC&CC=CN&NR=105259718A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG HAIMAN</creatorcontrib><creatorcontrib>GUO DONGSHENG</creatorcontrib><title>Chip-on-film structure and liquid crystal panel provided with same</title><description>The invention provides a chip-on-film structure. The structure comprises a film and a driving chip, wherein a set of input end leads and a set of output end leads are arranged on the film, a binding part is formed at the tail end of each output end lead, and the driving chip is arranged on the film and electrically connected to the input end leads and the output end leads. The position, connected with the tail end of the corresponding output end lead, of each binding part is defined as A, the position, away from the tail end of the corresponding output end lead, of each binding part is defined as B, the distance between A and B is L, and the area of each binding part is larger than that of the corresponding output end lead under the length L. According to the chip-on-film structure, binding yield can be increased, and manufacturing cost can be reduced. The invention further provides a liquid crystal panel provided with the chip-on-film structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHByzsgs0M3P003LzMlVKC4pKk0uKS1KVUjMS1HIySwszUxRSC6qLC5JzFEoSMxLBZJF-WWZKakpCuWZJRkKxYm5qTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DA1MjU0tzQwtGYGDUAPFgyFQ</recordid><startdate>20160120</startdate><enddate>20160120</enddate><creator>SONG HAIMAN</creator><creator>GUO DONGSHENG</creator><scope>EVB</scope></search><sort><creationdate>20160120</creationdate><title>Chip-on-film structure and liquid crystal panel provided with same</title><author>SONG HAIMAN ; GUO DONGSHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105259718A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG HAIMAN</creatorcontrib><creatorcontrib>GUO DONGSHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG HAIMAN</au><au>GUO DONGSHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip-on-film structure and liquid crystal panel provided with same</title><date>2016-01-20</date><risdate>2016</risdate><abstract>The invention provides a chip-on-film structure. The structure comprises a film and a driving chip, wherein a set of input end leads and a set of output end leads are arranged on the film, a binding part is formed at the tail end of each output end lead, and the driving chip is arranged on the film and electrically connected to the input end leads and the output end leads. The position, connected with the tail end of the corresponding output end lead, of each binding part is defined as A, the position, away from the tail end of the corresponding output end lead, of each binding part is defined as B, the distance between A and B is L, and the area of each binding part is larger than that of the corresponding output end lead under the length L. According to the chip-on-film structure, binding yield can be increased, and manufacturing cost can be reduced. The invention further provides a liquid crystal panel provided with the chip-on-film structure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
| title | Chip-on-film structure and liquid crystal panel provided with same |
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