Thermally conductive sheet, cured product thereof, and semiconductor device
A thermally conductive sheet includes a thermosetting resin and an inorganic filler material dispersed in the thermosetting resin. Measuring a pore diameter distribution through mercury intrusion technique for the inorganic filler material included in an incineration residue after a cured product of...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KITAGAWA KAZUYA HIRASAWA KAZUYA TSUDA MIKA SHIRATO YOJI MOCHIZUKI SHUNSUKE NAGAHASHI KEITA KUROKAWA MOTOMI |
| description | A thermally conductive sheet includes a thermosetting resin and an inorganic filler material dispersed in the thermosetting resin. Measuring a pore diameter distribution through mercury intrusion technique for the inorganic filler material included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700 DEG C. for four hours, a porosity of the inorganic filler material represented as 100b/a is greater than or equal to 40% and less than or equal to 65% given that a is the volume of particles of the inorganic filler material included in the incineration residue, and b is the volume of voids in the particles of the inorganic filler material included in the incineration residue. An average pore diameter of the inorganic filler material included in the incineration residue is greater than or equal to 0.20 [mu]m and less than or equal to 1.35 [mu]m. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN105244335A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN105244335A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN105244335A3</originalsourceid><addsrcrecordid>eNrjZPAOyUgtyk3MyalUSM7PSylNLsksS1UozkhNLdFRSC4tSk1RKCjKB4krlABVpuan6Sgk5qUoFKfmZkI15BcppKSWZSan8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QwNTIxMTY2NTR2Ni1AAAfrE1og</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermally conductive sheet, cured product thereof, and semiconductor device</title><source>esp@cenet</source><creator>KITAGAWA KAZUYA ; HIRASAWA KAZUYA ; TSUDA MIKA ; SHIRATO YOJI ; MOCHIZUKI SHUNSUKE ; NAGAHASHI KEITA ; KUROKAWA MOTOMI</creator><creatorcontrib>KITAGAWA KAZUYA ; HIRASAWA KAZUYA ; TSUDA MIKA ; SHIRATO YOJI ; MOCHIZUKI SHUNSUKE ; NAGAHASHI KEITA ; KUROKAWA MOTOMI</creatorcontrib><description>A thermally conductive sheet includes a thermosetting resin and an inorganic filler material dispersed in the thermosetting resin. Measuring a pore diameter distribution through mercury intrusion technique for the inorganic filler material included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700 DEG C. for four hours, a porosity of the inorganic filler material represented as 100b/a is greater than or equal to 40% and less than or equal to 65% given that a is the volume of particles of the inorganic filler material included in the incineration residue, and b is the volume of voids in the particles of the inorganic filler material included in the incineration residue. An average pore diameter of the inorganic filler material included in the incineration residue is greater than or equal to 0.20 [mu]m and less than or equal to 1.35 [mu]m.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160113&DB=EPODOC&CC=CN&NR=105244335A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160113&DB=EPODOC&CC=CN&NR=105244335A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KITAGAWA KAZUYA</creatorcontrib><creatorcontrib>HIRASAWA KAZUYA</creatorcontrib><creatorcontrib>TSUDA MIKA</creatorcontrib><creatorcontrib>SHIRATO YOJI</creatorcontrib><creatorcontrib>MOCHIZUKI SHUNSUKE</creatorcontrib><creatorcontrib>NAGAHASHI KEITA</creatorcontrib><creatorcontrib>KUROKAWA MOTOMI</creatorcontrib><title>Thermally conductive sheet, cured product thereof, and semiconductor device</title><description>A thermally conductive sheet includes a thermosetting resin and an inorganic filler material dispersed in the thermosetting resin. Measuring a pore diameter distribution through mercury intrusion technique for the inorganic filler material included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700 DEG C. for four hours, a porosity of the inorganic filler material represented as 100b/a is greater than or equal to 40% and less than or equal to 65% given that a is the volume of particles of the inorganic filler material included in the incineration residue, and b is the volume of voids in the particles of the inorganic filler material included in the incineration residue. An average pore diameter of the inorganic filler material included in the incineration residue is greater than or equal to 0.20 [mu]m and less than or equal to 1.35 [mu]m.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAOyUgtyk3MyalUSM7PSylNLsksS1UozkhNLdFRSC4tSk1RKCjKB4krlABVpuan6Sgk5qUoFKfmZkI15BcppKSWZSan8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_QwNTIxMTY2NTR2Ni1AAAfrE1og</recordid><startdate>20160113</startdate><enddate>20160113</enddate><creator>KITAGAWA KAZUYA</creator><creator>HIRASAWA KAZUYA</creator><creator>TSUDA MIKA</creator><creator>SHIRATO YOJI</creator><creator>MOCHIZUKI SHUNSUKE</creator><creator>NAGAHASHI KEITA</creator><creator>KUROKAWA MOTOMI</creator><scope>EVB</scope></search><sort><creationdate>20160113</creationdate><title>Thermally conductive sheet, cured product thereof, and semiconductor device</title><author>KITAGAWA KAZUYA ; HIRASAWA KAZUYA ; TSUDA MIKA ; SHIRATO YOJI ; MOCHIZUKI SHUNSUKE ; NAGAHASHI KEITA ; KUROKAWA MOTOMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN105244335A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KITAGAWA KAZUYA</creatorcontrib><creatorcontrib>HIRASAWA KAZUYA</creatorcontrib><creatorcontrib>TSUDA MIKA</creatorcontrib><creatorcontrib>SHIRATO YOJI</creatorcontrib><creatorcontrib>MOCHIZUKI SHUNSUKE</creatorcontrib><creatorcontrib>NAGAHASHI KEITA</creatorcontrib><creatorcontrib>KUROKAWA MOTOMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KITAGAWA KAZUYA</au><au>HIRASAWA KAZUYA</au><au>TSUDA MIKA</au><au>SHIRATO YOJI</au><au>MOCHIZUKI SHUNSUKE</au><au>NAGAHASHI KEITA</au><au>KUROKAWA MOTOMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermally conductive sheet, cured product thereof, and semiconductor device</title><date>2016-01-13</date><risdate>2016</risdate><abstract>A thermally conductive sheet includes a thermosetting resin and an inorganic filler material dispersed in the thermosetting resin. Measuring a pore diameter distribution through mercury intrusion technique for the inorganic filler material included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700 DEG C. for four hours, a porosity of the inorganic filler material represented as 100b/a is greater than or equal to 40% and less than or equal to 65% given that a is the volume of particles of the inorganic filler material included in the incineration residue, and b is the volume of voids in the particles of the inorganic filler material included in the incineration residue. An average pore diameter of the inorganic filler material included in the incineration residue is greater than or equal to 0.20 [mu]m and less than or equal to 1.35 [mu]m.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_CN105244335A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Thermally conductive sheet, cured product thereof, and semiconductor device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T20%3A32%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KITAGAWA%20KAZUYA&rft.date=2016-01-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN105244335A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |