Chip scale packaging method

The invention discloses a chip scale packaging method. Wafers with scribing grooves are taken as processing objects. The packaging method comprises the steps specifically: step a, preparing conductive lugs; step b, thinning; step c, coating an insulation protecting adhesive layer; step d, cutting, w...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	JIA DONGQING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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