Method for manufacturing printed circuit board

The invention discloses a method for manufacturing a printed circuit board. The printed board is made of a copper clad panel which is cheap, has excellent electric effect and can accurately conduct electric signals. The copper material is wear resistant and oxidation resistant, and the service lifetime of the circuit board is prolonged. After layout drawing is copied, Punching one small hole in each wire-threading hole in the copper-clad plate with a small punch, and the small holes are used for positioning, so that the boring position is more accurate. After cleaning, a paint film on the circuit board is grinded with a fine sand paper. The method of removing paint film with a sand paper is easy, and the circuit board may not be damaged in the process of removing the paint film. Hard papers tightly wind on a drill bit rod for five layers, and 4mm of drill bit is exposed. The diameter of the drilling rod is increased to increase clamping force, and probability of breaking the drill bit is reduced. After drilling is completed, the solder side is polished with a small flat drill. Pretreatment is conducted before refining, and the refining steps are substantially reduced.