Adhesive tape for semiconductor wafer protection
Provided is an adhesive tape for semiconductor wafer protection, which has heat resistance and thermal shrinkage resistance, and which is not fusion-bonded to a chuck table or is not excessively shrunk even if exposed to high heat during a gas etching step or a plasma dicing step. An adhesive tape f...
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| creator | OKURA MASATO |
| description | Provided is an adhesive tape for semiconductor wafer protection, which has heat resistance and thermal shrinkage resistance, and which is not fusion-bonded to a chuck table or is not excessively shrunk even if exposed to high heat during a gas etching step or a plasma dicing step. An adhesive tape for semiconductor wafer protection (1), which is characterized by comprising a base film (3) and an adhesive layer (5) that is formed on one surface of the base film (3), and which is also characterized in that the base film (3) has a cast film layer (7) that contains a cured resin and serves as the outermost layer on a side on which the adhesive layer (5) is not formed, and that the cast film layer (7) has a tackiness of 100 kPa or less at 200 degrees, is used. Alternatively, an adhesive tape for semiconductor wafer protection (1a), wherein the base film is formed only of the cast film layer (7), may be used. |
| format | Patent |
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An adhesive tape for semiconductor wafer protection (1), which is characterized by comprising a base film (3) and an adhesive layer (5) that is formed on one surface of the base film (3), and which is also characterized in that the base film (3) has a cast film layer (7) that contains a cured resin and serves as the outermost layer on a side on which the adhesive layer (5) is not formed, and that the cast film layer (7) has a tackiness of 100 kPa or less at 200 degrees, is used. 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An adhesive tape for semiconductor wafer protection (1), which is characterized by comprising a base film (3) and an adhesive layer (5) that is formed on one surface of the base film (3), and which is also characterized in that the base film (3) has a cast film layer (7) that contains a cured resin and serves as the outermost layer on a side on which the adhesive layer (5) is not formed, and that the cast film layer (7) has a tackiness of 100 kPa or less at 200 degrees, is used. 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An adhesive tape for semiconductor wafer protection (1), which is characterized by comprising a base film (3) and an adhesive layer (5) that is formed on one surface of the base film (3), and which is also characterized in that the base film (3) has a cast film layer (7) that contains a cured resin and serves as the outermost layer on a side on which the adhesive layer (5) is not formed, and that the cast film layer (7) has a tackiness of 100 kPa or less at 200 degrees, is used. Alternatively, an adhesive tape for semiconductor wafer protection (1a), wherein the base film is formed only of the cast film layer (7), may be used.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | Adhesive tape for semiconductor wafer protection |
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