Method and circuit for scalable cross point switching using 3-d die stacking
A cross-point switch having stacked switching dies on a component die is disclosed. The cross point switch allows scalability by adding switching dies. The switching dies include ingress switches that are coupled to multiplexers to a middle stage switches. The inputs and outputs of the ingress switc...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!