Solvent-free room temperature cross-linked organic silicon pressure-sensitive adhesive, and preparation method thereof

The invention discloses a solvent-free room temperature cross-linked organic silicon pressure-sensitive adhesive, and a preparation method thereof. The solvent-free room temperature cross-linked organic silicon pressure-sensitive adhesive is prepared from polydimethylsiloxane, boron silicon resin, a diluent, a room temperature cross-linking agent, and a catalyst, wherein the end group of polydimethylsiloxane is hydroxyl. The preparation method comprises following steps: step 1, boron silicon resin is prepared; step 2, polydimethylsiloxane, boron silicon resin, and the diluent are mixed, an obtained mixture is stirred to be uniform, is allowed to stand in a drying oven, and is cooled so as to obtain a base adhesive; and step 3, the base adhesive is divided into two equal parts, a first part is uniformly mixed with the room temperature corss-linking agent, a second part is uniformly mixed with the catalyst, two obtained mixed materials are uniformly mixed, an obtained product is coated onto a polyimide film via scraping, and is allowed to stand at room temperature so as to obtain the solvent-free room temperature cross-linked organic silicon pressure-sensitive adhesive. The solvent-free room temperature cross-linked organic silicon pressure-sensitive adhesive possesses relatively excellent first viscosity, persistent adhesivity, and peeling strength, and relatively high temperature resistance grade, is nontoxic and friendly to the environment, and is capable of realizing cross-linking at room temperature. The solvent-free room temperature cross-linked organic silicon pressure-sensitive adhesive is mainly applied to the field of pressure-sensitive adhesive.