COOLING SYSTEM WITH REDUNDANCY

COOLING SYSTEM WITH REDUNDANCY

A cooling apparatus comprises: an interfacing component that receives an electronic device and defines a convective thermal interface through which heat generated by the electronic device can be transferred via an inner coolant; and a heat exchanger arrangement, coupled to the convective thermal int...

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Hauptverfasser: DEAKIN KEITH, BENT JASON, HOPTON PETER
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator DEAKIN KEITH
BENT JASON
HOPTON PETER
description A cooling apparatus comprises: an interfacing component that receives an electronic device and defines a convective thermal interface through which heat generated by the electronic device can be transferred via an inner coolant; and a heat exchanger arrangement, coupled to the convective thermal interface that transfers heat generated by the electronic device via the thermal interface to first and second isolated heat sinks. In the event that a part of the heat exchanger arrangement is unable to transfer heat to the first heat sink, it transfers at least some of the heat that would have been transferred to the first heat sink to the second heat sink. The heat exchanger arrangement comprises: a first coolant connector, receiving a first outer coolant as part of the first heat sink; and a second coolant connector, receiving a second outer coolant as part of the second heat sink.
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In the event that a part of the heat exchanger arrangement is unable to transfer heat to the first heat sink, it transfers at least some of the heat that would have been transferred to the first heat sink to the second heat sink. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title COOLING SYSTEM WITH REDUNDANCY
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