Fingerprint module group manufacturing method and fingerprint module group

An embodiment of the invention discloses a fingerprint module group manufacturing method and a fingerprint module group. The technical problems on glue overflow, glue content control and thickness control caused by that metal frames are fixed by glue and silver colloids, as well as the technical problems of poor contact in dispensing the silver colloids, high price of the silver colloids, difficulty for storing the silver colloids and waste of the silver colloids due to low consumption in use are solved. The fingerprint module group manufacturing method disclosed by the embodiment of the invention comprises the steps of: laminating a sensor, a substrate and a flexible printed circuit board after being sprayed into a first module through a surface mount technology; and laminating the first module group and a metal frame into the fingerprint module group through a conductive double-sided bonding part.