Copper electroplating liquid
The invention provides a copper electroplating liquid. The copper electroplating liquid is composed of the following components: 70-90g/L of copper pyrophosphate (Cu2O7P2), 300-350g/L of potassium pyrophosphate (K4O7P2), 2-5ml/L of ammonia water (NH3.H2O) and the balance of deionized water. The pH v...
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creator | QIU YONGHUA |
description | The invention provides a copper electroplating liquid. The copper electroplating liquid is composed of the following components: 70-90g/L of copper pyrophosphate (Cu2O7P2), 300-350g/L of potassium pyrophosphate (K4O7P2), 2-5ml/L of ammonia water (NH3.H2O) and the balance of deionized water. The pH value of the copper electroplating liquid is within the range of 8.5-9.2. The copper pyrophosphate is used for providing copper ions for the electroplating liquid and increasing the conductive action; the potassium pyrophosphate mainly plays a role in electric conduction, thereby improving the dispersity of the copper pyrophosphate in the electroplating liquid and maintaining the stability of the electroplating liquid; the ammonia water is used for improving the brightness of a coating. As the copper electroplating liquid is free from cyanides, the wastewater is easy to treat, the production cost is low, and the environmental pollution is avoided. |
format | Patent |
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The copper electroplating liquid is composed of the following components: 70-90g/L of copper pyrophosphate (Cu2O7P2), 300-350g/L of potassium pyrophosphate (K4O7P2), 2-5ml/L of ammonia water (NH3.H2O) and the balance of deionized water. The pH value of the copper electroplating liquid is within the range of 8.5-9.2. The copper pyrophosphate is used for providing copper ions for the electroplating liquid and increasing the conductive action; the potassium pyrophosphate mainly plays a role in electric conduction, thereby improving the dispersity of the copper pyrophosphate in the electroplating liquid and maintaining the stability of the electroplating liquid; the ammonia water is used for improving the brightness of a coating. As the copper electroplating liquid is free from cyanides, the wastewater is easy to treat, the production cost is low, and the environmental pollution is avoided.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151007&DB=EPODOC&CC=CN&NR=104962960A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151007&DB=EPODOC&CC=CN&NR=104962960A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>QIU YONGHUA</creatorcontrib><title>Copper electroplating liquid</title><description>The invention provides a copper electroplating liquid. The copper electroplating liquid is composed of the following components: 70-90g/L of copper pyrophosphate (Cu2O7P2), 300-350g/L of potassium pyrophosphate (K4O7P2), 2-5ml/L of ammonia water (NH3.H2O) and the balance of deionized water. The pH value of the copper electroplating liquid is within the range of 8.5-9.2. The copper pyrophosphate is used for providing copper ions for the electroplating liquid and increasing the conductive action; the potassium pyrophosphate mainly plays a role in electric conduction, thereby improving the dispersity of the copper pyrophosphate in the electroplating liquid and maintaining the stability of the electroplating liquid; the ammonia water is used for improving the brightness of a coating. As the copper electroplating liquid is free from cyanides, the wastewater is easy to treat, the production cost is low, and the environmental pollution is avoided.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBxzi8oSC1SSM1JTS4pyi_ISSzJzEtXyMksLM1M4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYmlmZGlmYGjsbEqAEAwPwkGw</recordid><startdate>20151007</startdate><enddate>20151007</enddate><creator>QIU YONGHUA</creator><scope>EVB</scope></search><sort><creationdate>20151007</creationdate><title>Copper electroplating liquid</title><author>QIU YONGHUA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN104962960A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>QIU YONGHUA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>QIU YONGHUA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Copper electroplating liquid</title><date>2015-10-07</date><risdate>2015</risdate><abstract>The invention provides a copper electroplating liquid. The copper electroplating liquid is composed of the following components: 70-90g/L of copper pyrophosphate (Cu2O7P2), 300-350g/L of potassium pyrophosphate (K4O7P2), 2-5ml/L of ammonia water (NH3.H2O) and the balance of deionized water. The pH value of the copper electroplating liquid is within the range of 8.5-9.2. The copper pyrophosphate is used for providing copper ions for the electroplating liquid and increasing the conductive action; the potassium pyrophosphate mainly plays a role in electric conduction, thereby improving the dispersity of the copper pyrophosphate in the electroplating liquid and maintaining the stability of the electroplating liquid; the ammonia water is used for improving the brightness of a coating. As the copper electroplating liquid is free from cyanides, the wastewater is easy to treat, the production cost is low, and the environmental pollution is avoided.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
title | Copper electroplating liquid |
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