Sensor element adhering device

The invention provides a sensor element adhering device. The sensor element adhering device comprises a suction disk, a heating power supply, a mould groove and an electric heater, wherein the electric heater and an adhesive mould are arranged in an inner cavity of a housing of the suction disk in sequence; the electric heater is in contact with the upper end of the adhesive mould and is electrically connected to the heating power supply; an opening is formed in the lower end of the housing of the suction disk; the mould groove is formed in the lower end of the adhesive mould; an opening of the mould groove corresponds to the opening of the lower end of the housing; the mould groove is used for accommodating adhesives for fixing sensor elements; the electric heater is used for heating the adhesives in the mould groove according to the heating power supply. After the adhesives are cured and shaped, the adhesives for adhering the sensor elements on a plurality of parts of the same type are the same in shape; the structural data of the same type of parts detected by the sensor elements is reliable; the accuracy of the structural data analysis of the parts is improved.