Integrated energy collecting store with three-dimensional stack/trench composite structure
The invention discloses an integrated energy collecting store with a three-dimensional stack/trench composite structure. The integrated energy collecting store is characterized in that an energy collecting store is integrated on a substrate with a PN junction, wherein a P type semiconductor area and...
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creator | ZHANG WEICONG CHEN YUANNING DAI ZHENGWU |
description | The invention discloses an integrated energy collecting store with a three-dimensional stack/trench composite structure. The integrated energy collecting store is characterized in that an energy collecting store is integrated on a substrate with a PN junction, wherein a P type semiconductor area and an N type semiconductor area of the PN junction are respectively connected with a metal electrode to serve as energy collectors; the three-dimensional stack/trench composite structure is arranged on the side, opposite to the PN junction, of the substrate to serve as an energy store; and the composite structure is characterized in that a three-dimensional trench structure is firstly arranged on the substrate, then metal layers and medium layers are alternatively deposited on the substrate provided with the trench structure to form a plurality of parallelly-connected capacitor, finally the top part is the metal layer which fills the trench and covers the surface of the substrate, and the top metal layer and the bottom metal layer are respectively connected with a metal electrode. By adopting the three-dimensional structure, the capacity of the memory is improved, the cost is reduced, and the size is reduced; in addition, the preparing technology flow is simple and is compatible with a low-cost integrated circuit technology. |
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The integrated energy collecting store is characterized in that an energy collecting store is integrated on a substrate with a PN junction, wherein a P type semiconductor area and an N type semiconductor area of the PN junction are respectively connected with a metal electrode to serve as energy collectors; the three-dimensional stack/trench composite structure is arranged on the side, opposite to the PN junction, of the substrate to serve as an energy store; and the composite structure is characterized in that a three-dimensional trench structure is firstly arranged on the substrate, then metal layers and medium layers are alternatively deposited on the substrate provided with the trench structure to form a plurality of parallelly-connected capacitor, finally the top part is the metal layer which fills the trench and covers the surface of the substrate, and the top metal layer and the bottom metal layer are respectively connected with a metal electrode. 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The integrated energy collecting store is characterized in that an energy collecting store is integrated on a substrate with a PN junction, wherein a P type semiconductor area and an N type semiconductor area of the PN junction are respectively connected with a metal electrode to serve as energy collectors; the three-dimensional stack/trench composite structure is arranged on the side, opposite to the PN junction, of the substrate to serve as an energy store; and the composite structure is characterized in that a three-dimensional trench structure is firstly arranged on the substrate, then metal layers and medium layers are alternatively deposited on the substrate provided with the trench structure to form a plurality of parallelly-connected capacitor, finally the top part is the metal layer which fills the trench and covers the surface of the substrate, and the top metal layer and the bottom metal layer are respectively connected with a metal electrode. 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The integrated energy collecting store is characterized in that an energy collecting store is integrated on a substrate with a PN junction, wherein a P type semiconductor area and an N type semiconductor area of the PN junction are respectively connected with a metal electrode to serve as energy collectors; the three-dimensional stack/trench composite structure is arranged on the side, opposite to the PN junction, of the substrate to serve as an energy store; and the composite structure is characterized in that a three-dimensional trench structure is firstly arranged on the substrate, then metal layers and medium layers are alternatively deposited on the substrate provided with the trench structure to form a plurality of parallelly-connected capacitor, finally the top part is the metal layer which fills the trench and covers the surface of the substrate, and the top metal layer and the bottom metal layer are respectively connected with a metal electrode. By adopting the three-dimensional structure, the capacity of the memory is improved, the cost is reduced, and the size is reduced; in addition, the preparing technology flow is simple and is compatible with a low-cost integrated circuit technology.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
title | Integrated energy collecting store with three-dimensional stack/trench composite structure |
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