Circuit connection structure, semiconductor apparatus, solar cell module and manufacturing method and application thereof

The invention provides a circuit connection structure, a semiconductor device and a solar cell module and a manufacturing method and an application thereof. The circuit connection structure comprises a pair of circuit members facing each other, and a connect member, which is installed between the pa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUJIEDA TADAYASU, FUJINAWA TOHRU, ARIFUKU MOTOHIRO, MATSUDA KAZUYA, KUDOU SUNAO, KOBAYASHI KOUJ, IZAWA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides a circuit connection structure, a semiconductor device and a solar cell module and a manufacturing method and an application thereof. The circuit connection structure comprises a pair of circuit members facing each other, and a connect member, which is installed between the pair of circuit members, in order to attach the circuit members for electrically connecting each circuit electrode of the pair of circuit member. The connect member contains the hardened material of an adhesive composition. The adhesive composition comprises 5-18 weight% acryl rubber having a structure originated from acrylonitrile, urethane (meth)acrylate, and a radical polymerization initiator.