Manufacture Of Electronic Module

Manufacture Of Electronic Module

The invention relates to a method used for manufacturing an electronic module (L), especially a power electronic module (S1-S8). The method includes at least one semiconductor chip (3, 4) contacted with a contact of at least one lead frame (1). The upper side and the lower side of the semiconductor...

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Hauptverfasser: MICHAEL LEIPENAT, RONNY WERNER
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MICHAEL LEIPENAT
RONNY WERNER
description The invention relates to a method used for manufacturing an electronic module (L), especially a power electronic module (S1-S8). The method includes at least one semiconductor chip (3, 4) contacted with a contact of at least one lead frame (1). The upper side and the lower side of the semiconductor chip (3, 4) are provided with at least one electric interface (8, 9). Besides, the at least one lead frame (1) is in contact connection with at least one interface (8, 9). The electronic module can be manufactured with the method (S1-S8). The electronic module can be applied to the power electronic module.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Manufacture Of Electronic Module
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