Methods for packaging integrated circuits

The invention relates to methods for packaging integrated circuits. Techniques for packaging an integrated circuit include attaching a die to a conductive layer before forming dielectric layers on an opposing surface of the conductive layer. The conductive layer may first be formed on a carrier subs...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN PING CHET, TAN LOON KWANG, XIE YUANLIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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