Semiconductor package and method for producing a semiconductor package

Semiconductor package and method for producing a semiconductor package

The invention discloses a semiconductor package and a method for producing a semiconductor package. A device includes a die and at least one of an encapsulant at least partly encapsulating the die and a carrier to which the die is attached. The at least one of the encapsulant and the carrier include...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: JOACHIM MAHLER
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention discloses a semiconductor package and a method for producing a semiconductor package. A device includes a die and at least one of an encapsulant at least partly encapsulating the die and a carrier to which the die is attached. The at least one of the encapsulant and the carrier includes a thermoplastic polymer that includes metallic particles.