Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet
[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an adherend. [Solution] A sheet according to the present inventio...
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| creator | ICHIKAWA ISAO FURUDATE MASAAKI KOZONE YUICHI |
| description | [Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an adherend. [Solution] A sheet according to the present invention that is provided with a curable resin film-forming layer, which comprises a supporting sheet and the curable resin film-forming layer that is formed in a peelable manner on the supporting sheet, is characterized in that: the curable resin film-forming layer comprises a curable binder component and a silane coupling agent (C); and, on at least one surface of a resin film that is obtained by curing the curable resin film-forming layer, the concentration (X) of surface silicon element derived from the silane coupling agent (C) is 3.4 times or higher of the average concentration (Y) of inner silicon element derived from the silane coupling agent (C), said average concentration (Y) being determined by measuring the concentration of inner silicon derived from the silane coupling agent (C) at least at one point in each of the depth ranges of 40-60 nm, 60-80 nm and 80-100 nm in the depth direction from the aforesaid surface, i.e., at least at three points in total. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN104797423A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN104797423A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN104797423A3</originalsourceid><addsrcrecordid>eNqNzb0KwjAYheEuDqLew-cFFNQWxFGK4uSie4nJiQ3kp3xJKt69rXgBTmd4Xjjzgm8dkKjnMBgFRS-TOpKZxcOCGNF40sa6Ugd2xj_JijeYhFfkkLqgaARywmctZMo8JRHOyOBVlmk0hcFIUI5fms6WxUwLG7H67aJYn0_35lKiDy1iLyQ8Uttct5t6f9jXu-pY_dN8ADUCRLU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet</title><source>esp@cenet</source><creator>ICHIKAWA ISAO ; FURUDATE MASAAKI ; KOZONE YUICHI</creator><creatorcontrib>ICHIKAWA ISAO ; FURUDATE MASAAKI ; KOZONE YUICHI</creatorcontrib><description>[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an adherend. [Solution] A sheet according to the present invention that is provided with a curable resin film-forming layer, which comprises a supporting sheet and the curable resin film-forming layer that is formed in a peelable manner on the supporting sheet, is characterized in that: the curable resin film-forming layer comprises a curable binder component and a silane coupling agent (C); and, on at least one surface of a resin film that is obtained by curing the curable resin film-forming layer, the concentration (X) of surface silicon element derived from the silane coupling agent (C) is 3.4 times or higher of the average concentration (Y) of inner silicon element derived from the silane coupling agent (C), said average concentration (Y) being determined by measuring the concentration of inner silicon derived from the silane coupling agent (C) at least at one point in each of the depth ranges of 40-60 nm, 60-80 nm and 80-100 nm in the depth direction from the aforesaid surface, i.e., at least at three points in total.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150722&DB=EPODOC&CC=CN&NR=104797423A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150722&DB=EPODOC&CC=CN&NR=104797423A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ICHIKAWA ISAO</creatorcontrib><creatorcontrib>FURUDATE MASAAKI</creatorcontrib><creatorcontrib>KOZONE YUICHI</creatorcontrib><title>Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet</title><description>[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an adherend. [Solution] A sheet according to the present invention that is provided with a curable resin film-forming layer, which comprises a supporting sheet and the curable resin film-forming layer that is formed in a peelable manner on the supporting sheet, is characterized in that: the curable resin film-forming layer comprises a curable binder component and a silane coupling agent (C); and, on at least one surface of a resin film that is obtained by curing the curable resin film-forming layer, the concentration (X) of surface silicon element derived from the silane coupling agent (C) is 3.4 times or higher of the average concentration (Y) of inner silicon element derived from the silane coupling agent (C), said average concentration (Y) being determined by measuring the concentration of inner silicon derived from the silane coupling agent (C) at least at one point in each of the depth ranges of 40-60 nm, 60-80 nm and 80-100 nm in the depth direction from the aforesaid surface, i.e., at least at three points in total.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzb0KwjAYheEuDqLew-cFFNQWxFGK4uSie4nJiQ3kp3xJKt69rXgBTmd4Xjjzgm8dkKjnMBgFRS-TOpKZxcOCGNF40sa6Ugd2xj_JijeYhFfkkLqgaARywmctZMo8JRHOyOBVlmk0hcFIUI5fms6WxUwLG7H67aJYn0_35lKiDy1iLyQ8Uttct5t6f9jXu-pY_dN8ADUCRLU</recordid><startdate>20150722</startdate><enddate>20150722</enddate><creator>ICHIKAWA ISAO</creator><creator>FURUDATE MASAAKI</creator><creator>KOZONE YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20150722</creationdate><title>Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet</title><author>ICHIKAWA ISAO ; FURUDATE MASAAKI ; KOZONE YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN104797423A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ICHIKAWA ISAO</creatorcontrib><creatorcontrib>FURUDATE MASAAKI</creatorcontrib><creatorcontrib>KOZONE YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ICHIKAWA ISAO</au><au>FURUDATE MASAAKI</au><au>KOZONE YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet</title><date>2015-07-22</date><risdate>2015</risdate><abstract>[Problem] To improve the adhesion between a resin film-forming layer, which serves as a precursor of an adhesive film or protective film, or a cured resin film obtained therefrom and a semiconductor chip or semiconductor wafer that is an adherend. [Solution] A sheet according to the present invention that is provided with a curable resin film-forming layer, which comprises a supporting sheet and the curable resin film-forming layer that is formed in a peelable manner on the supporting sheet, is characterized in that: the curable resin film-forming layer comprises a curable binder component and a silane coupling agent (C); and, on at least one surface of a resin film that is obtained by curing the curable resin film-forming layer, the concentration (X) of surface silicon element derived from the silane coupling agent (C) is 3.4 times or higher of the average concentration (Y) of inner silicon element derived from the silane coupling agent (C), said average concentration (Y) being determined by measuring the concentration of inner silicon derived from the silane coupling agent (C) at least at one point in each of the depth ranges of 40-60 nm, 60-80 nm and 80-100 nm in the depth direction from the aforesaid surface, i.e., at least at three points in total.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet |
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