Semiconductor packaging arrangement

Semiconductor packaging arrangement

A semiconductor packaging arrangement includes a transistor device including a first side including a source electrode and a gate electrode, a die pad having a first surface, and a lead having a first surface. A first conductive member is arranged between the source electrode and the first surface o...

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Hauptverfasser: JOSEF HOEGLAUER, RALF OTREMBA, JUERGEN SCHREDL, KLAUS SCHIESS, XAVER SCHLOEGEL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator JOSEF HOEGLAUER
RALF OTREMBA
JUERGEN SCHREDL
KLAUS SCHIESS
XAVER SCHLOEGEL
description A semiconductor packaging arrangement includes a transistor device including a first side including a source electrode and a gate electrode, a die pad having a first surface, and a lead having a first surface. A first conductive member is arranged between the source electrode and the first surface of the die pad and spaces the source electrode from the first surface of the die pad by a distance that is greater than a distance between the gate electrode and the first surface of the lead.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor packaging arrangement
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