Semiconductor package and fabrication method thereof

The invention provides a semiconductor package and a method for manufacturing the same. The semiconductor package includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG LUNG-YUAN, CHIANG CHENGIA, JIANG DON-SON, HUANG SHU-HUEI, TUNG SHIH-HAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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