Optical device, method for manufacturing same, and electronic device
The purpose of the present invention is to provide an optical device wherein an optical element is able to be effectively encapsulated without requiring a special material or structure. In an optical device of the present invention, an encapsulation part (50) comprises: an annular sealing part (51)...
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| creator | SONG GYONGSOK AOYAGI AKIYOSHI |
| description | The purpose of the present invention is to provide an optical device wherein an optical element is able to be effectively encapsulated without requiring a special material or structure. In an optical device of the present invention, an encapsulation part (50) comprises: an annular sealing part (51) that surrounds one or more optical elements (40) on a wiring board in the in-plane direction of the wiring board; and an inner filling part (52) that is filled into the inside of the sealing part (51) and encapsulates the one or more optical elements (40). Each optical element (40) is a light emitting device, a light receiving element, an image sensor, an X ray sensor or a power generating element. The sealing part (51) and the inner filling part (52) are obtained by curing a thermosetting resin. The light transmittance of the inner filling part (52) is higher than the light transmittance of the sealing part (51). The elastic modulus of the inner filling part (52) is lower than the elastic modulus of the sealing part (51). |
| format | Patent |
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In an optical device of the present invention, an encapsulation part (50) comprises: an annular sealing part (51) that surrounds one or more optical elements (40) on a wiring board in the in-plane direction of the wiring board; and an inner filling part (52) that is filled into the inside of the sealing part (51) and encapsulates the one or more optical elements (40). Each optical element (40) is a light emitting device, a light receiving element, an image sensor, an X ray sensor or a power generating element. The sealing part (51) and the inner filling part (52) are obtained by curing a thermosetting resin. The light transmittance of the inner filling part (52) is higher than the light transmittance of the sealing part (51). The elastic modulus of the inner filling part (52) is lower than the elastic modulus of the sealing part (51).</description><language>eng</language><subject>ADVERTISING ; BASIC ELECTRIC ELEMENTS ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LABELS OR NAME-PLATES ; PHYSICS ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEALS ; SEMICONDUCTOR DEVICES ; SIGNS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150701&DB=EPODOC&CC=CN&NR=104756178A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150701&DB=EPODOC&CC=CN&NR=104756178A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG GYONGSOK</creatorcontrib><creatorcontrib>AOYAGI AKIYOSHI</creatorcontrib><title>Optical device, method for manufacturing same, and electronic device</title><description>The purpose of the present invention is to provide an optical device wherein an optical element is able to be effectively encapsulated without requiring a special material or structure. In an optical device of the present invention, an encapsulation part (50) comprises: an annular sealing part (51) that surrounds one or more optical elements (40) on a wiring board in the in-plane direction of the wiring board; and an inner filling part (52) that is filled into the inside of the sealing part (51) and encapsulates the one or more optical elements (40). Each optical element (40) is a light emitting device, a light receiving element, an image sensor, an X ray sensor or a power generating element. The sealing part (51) and the inner filling part (52) are obtained by curing a thermosetting resin. The light transmittance of the inner filling part (52) is higher than the light transmittance of the sealing part (51). 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In an optical device of the present invention, an encapsulation part (50) comprises: an annular sealing part (51) that surrounds one or more optical elements (40) on a wiring board in the in-plane direction of the wiring board; and an inner filling part (52) that is filled into the inside of the sealing part (51) and encapsulates the one or more optical elements (40). Each optical element (40) is a light emitting device, a light receiving element, an image sensor, an X ray sensor or a power generating element. The sealing part (51) and the inner filling part (52) are obtained by curing a thermosetting resin. The light transmittance of the inner filling part (52) is higher than the light transmittance of the sealing part (51). The elastic modulus of the inner filling part (52) is lower than the elastic modulus of the sealing part (51).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEALS SEMICONDUCTOR DEVICES SIGNS |
| title | Optical device, method for manufacturing same, and electronic device |
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