Packaged laser diode and method for packaging laser diode
The invention provides a lead frame packaged laser diode, wherein a laser diode chip is electrically decoupled to a package. A lead frame package is also provided and comprises a two-dimensional grid of an electrode wrapped in a molded plastic frame. The two-dimensional grid may perform batch proces...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention provides a lead frame packaged laser diode, wherein a laser diode chip is electrically decoupled to a package. A lead frame package is also provided and comprises a two-dimensional grid of an electrode wrapped in a molded plastic frame. The two-dimensional grid may perform batch processing on the one-dimensional or two-dimensional array of the lead frame. The batch processing comprises laser diode chip mounting, lead bonding and packaging, and separating the single packaged laser diode from the one-dimensional or two-dimensional array. |
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