Printed wiring board and method for manufacturing printed wiring board
The present invention relates to a printed wiring board and a method for manufacturing such a printed wiring board. The printed wiring board 10 has first resin insulation layer (50A) and second insulation layer (50B).The The printed wiring board includes resin insulation layers and conductive layers...
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| creator | ISHIKAWA SHINSUKE NISHIOKA HIROYUKI |
| description | The present invention relates to a printed wiring board and a method for manufacturing such a printed wiring board. The printed wiring board 10 has first resin insulation layer (50A) and second insulation layer (50B).The The printed wiring board includes resin insulation layers and conductive layers, all of which are highly adhered to upper layers. A modified resin layer (82B) and a modified conductive layer (84B) are respectively formed by microwave-excited plasma treatment on a first resin insulation layer (50A) and a first conductive layer (58A).Because of such modified resin layer (82A) and modified conductive layer (84A), first resin insulation layer (50A) and first conductive layer (58A) exhibit enhanced adhesiveness to second resin insulation layer (50B) positioned as their upper layer. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN104703385A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN104703385A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN104703385A3</originalsourceid><addsrcrecordid>eNrjZHALKMrMK0lNUSjPBDLSFZLyE4tSFBLzUhRyU0sy8lMU0vKLFHIT80rTEpNLSsFKCrDo4GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYm5gbGxhamjsbEqAEAPRAztg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed wiring board and method for manufacturing printed wiring board</title><source>esp@cenet</source><creator>ISHIKAWA SHINSUKE ; NISHIOKA HIROYUKI</creator><creatorcontrib>ISHIKAWA SHINSUKE ; NISHIOKA HIROYUKI</creatorcontrib><description>The present invention relates to a printed wiring board and a method for manufacturing such a printed wiring board. The printed wiring board 10 has first resin insulation layer (50A) and second insulation layer (50B).The The printed wiring board includes resin insulation layers and conductive layers, all of which are highly adhered to upper layers. A modified resin layer (82B) and a modified conductive layer (84B) are respectively formed by microwave-excited plasma treatment on a first resin insulation layer (50A) and a first conductive layer (58A).Because of such modified resin layer (82A) and modified conductive layer (84A), first resin insulation layer (50A) and first conductive layer (58A) exhibit enhanced adhesiveness to second resin insulation layer (50B) positioned as their upper layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150610&DB=EPODOC&CC=CN&NR=104703385A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150610&DB=EPODOC&CC=CN&NR=104703385A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISHIKAWA SHINSUKE</creatorcontrib><creatorcontrib>NISHIOKA HIROYUKI</creatorcontrib><title>Printed wiring board and method for manufacturing printed wiring board</title><description>The present invention relates to a printed wiring board and a method for manufacturing such a printed wiring board. The printed wiring board 10 has first resin insulation layer (50A) and second insulation layer (50B).The The printed wiring board includes resin insulation layers and conductive layers, all of which are highly adhered to upper layers. A modified resin layer (82B) and a modified conductive layer (84B) are respectively formed by microwave-excited plasma treatment on a first resin insulation layer (50A) and a first conductive layer (58A).Because of such modified resin layer (82A) and modified conductive layer (84A), first resin insulation layer (50A) and first conductive layer (58A) exhibit enhanced adhesiveness to second resin insulation layer (50B) positioned as their upper layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALKMrMK0lNUSjPBDLSFZLyE4tSFBLzUhRyU0sy8lMU0vKLFHIT80rTEpNLSsFKCrDo4GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hgYm5gbGxhamjsbEqAEAPRAztg</recordid><startdate>20150610</startdate><enddate>20150610</enddate><creator>ISHIKAWA SHINSUKE</creator><creator>NISHIOKA HIROYUKI</creator><scope>EVB</scope></search><sort><creationdate>20150610</creationdate><title>Printed wiring board and method for manufacturing printed wiring board</title><author>ISHIKAWA SHINSUKE ; NISHIOKA HIROYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN104703385A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ISHIKAWA SHINSUKE</creatorcontrib><creatorcontrib>NISHIOKA HIROYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISHIKAWA SHINSUKE</au><au>NISHIOKA HIROYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed wiring board and method for manufacturing printed wiring board</title><date>2015-06-10</date><risdate>2015</risdate><abstract>The present invention relates to a printed wiring board and a method for manufacturing such a printed wiring board. The printed wiring board 10 has first resin insulation layer (50A) and second insulation layer (50B).The The printed wiring board includes resin insulation layers and conductive layers, all of which are highly adhered to upper layers. A modified resin layer (82B) and a modified conductive layer (84B) are respectively formed by microwave-excited plasma treatment on a first resin insulation layer (50A) and a first conductive layer (58A).Because of such modified resin layer (82A) and modified conductive layer (84A), first resin insulation layer (50A) and first conductive layer (58A) exhibit enhanced adhesiveness to second resin insulation layer (50B) positioned as their upper layer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Printed wiring board and method for manufacturing printed wiring board |
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