Electronic Package And Fabrication Method Thereof

An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and expose...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHU YUDE, TSAI TSUNG-HSIE, CHIU CHIH-HSIEN, CHUNG HSIN-LUNG, FANG HAO-JU
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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