Electronic Package And Fabrication Method Thereof
An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and expose...
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| creator | CHU YUDE TSAI TSUNG-HSIE CHIU CHIH-HSIEN CHUNG HSIN-LUNG FANG HAO-JU |
| description | An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package. |
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Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150603&DB=EPODOC&CC=CN&NR=104681511A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150603&DB=EPODOC&CC=CN&NR=104681511A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHU YUDE</creatorcontrib><creatorcontrib>TSAI TSUNG-HSIE</creatorcontrib><creatorcontrib>CHIU CHIH-HSIEN</creatorcontrib><creatorcontrib>CHUNG HSIN-LUNG</creatorcontrib><creatorcontrib>FANG HAO-JU</creatorcontrib><title>Electronic Package And Fabrication Method Thereof</title><description>An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. 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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Electronic Package And Fabrication Method Thereof |
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