Glass laminated body and electronic device manufacturing method

The present invention relates to a glass laminated body and an electronic device manufacturing method. The glass laminated body comprises a support substrate with an inorganic layer, and a glass substrate. The support substrate is composed of a support substrate and an inorganic layer arranged on th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUANGYAO NIU, YOSUKE AKITA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to a glass laminated body and an electronic device manufacturing method. The glass laminated body comprises a support substrate with an inorganic layer, and a glass substrate. The support substrate is composed of a support substrate and an inorganic layer arranged on the support substrate. The glass substrate is laminated on the surface of the inorganic layer in a peelable manner. That is, the inorganic layer is arranged on the opposite side of the support substrate. The inorganic layer is composed of SiC1-xOx and/or SiN1-yOy as the surface of the inorganic layer, wherein x=0.10-0.90 and y=0.10-0.90. The surface roughness Ra of the inorganic layer is 0.20 nm-1.00 nm.