Preparation method of LED white light diode

Preparation method of LED white light diode

The invention discloses a preparation method of an LED white light diode. The LED white light diode comprises first and second leads, a blue LED chip and an epoxy resin adhesive layer containing yellow fluorescent powder; each of the first and second leads is provided with integrated first and secon...

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1. Verfasser: JIA DONGQING
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The invention discloses a preparation method of an LED white light diode. The LED white light diode comprises first and second leads, a blue LED chip and an epoxy resin adhesive layer containing yellow fluorescent powder; each of the first and second leads is provided with integrated first and second mounting islands and integrated first and second pins; the blue LED chip is mounted on the first mounting island and electrically connected with the first mounting island; the surface of the blue LED chip is electrically connected with the second mounting island; the first mounting island, the second mounting island and the blue LED chip are covered with the epoxy resin adhesive layer containing the yellow fluorescent powder; the preparation method of the LED white light diode comprises the step a of preparing the epoxy resin adhesive layer cake containing the yellow fluorescent powder, the step b of die bonding, the step c of bonding, the step d of injection molding and solidifying, and the step e of forming, thereby obtaining the LED white light diode. The preparation method is reasonable, high in production efficiency and low in investment cost.
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The LED white light diode comprises first and second leads, a blue LED chip and an epoxy resin adhesive layer containing yellow fluorescent powder; each of the first and second leads is provided with integrated first and second mounting islands and integrated first and second pins; the blue LED chip is mounted on the first mounting island and electrically connected with the first mounting island; the surface of the blue LED chip is electrically connected with the second mounting island; the first mounting island, the second mounting island and the blue LED chip are covered with the epoxy resin adhesive layer containing the yellow fluorescent powder; the preparation method of the LED white light diode comprises the step a of preparing the epoxy resin adhesive layer cake containing the yellow fluorescent powder, the step b of die bonding, the step c of bonding, the step d of injection molding and solidifying, and the step e of forming, thereby obtaining the LED white light diode. 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The LED white light diode comprises first and second leads, a blue LED chip and an epoxy resin adhesive layer containing yellow fluorescent powder; each of the first and second leads is provided with integrated first and second mounting islands and integrated first and second pins; the blue LED chip is mounted on the first mounting island and electrically connected with the first mounting island; the surface of the blue LED chip is electrically connected with the second mounting island; the first mounting island, the second mounting island and the blue LED chip are covered with the epoxy resin adhesive layer containing the yellow fluorescent powder; the preparation method of the LED white light diode comprises the step a of preparing the epoxy resin adhesive layer cake containing the yellow fluorescent powder, the step b of die bonding, the step c of bonding, the step d of injection molding and solidifying, and the step e of forming, thereby obtaining the LED white light diode. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Preparation method of LED white light diode
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