Light emitting diode (LED) integrated encapsulation structure and manufacturing method thereof

Light emitting diode (LED) integrated encapsulation structure and manufacturing method thereof

The invention discloses an LED integrated encapsulation structure. The structure comprises a composite substrate and a plurality of LEDs. The composite substrate comprises a first surface and a second surface, wherein the first surface is opposite to the second surface, and also comprises an insulat...

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1. Verfasser: LIN SUHONG
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIN SUHONG
description The invention discloses an LED integrated encapsulation structure. The structure comprises a composite substrate and a plurality of LEDs. The composite substrate comprises a first surface and a second surface, wherein the first surface is opposite to the second surface, and also comprises an insulated base material part, which comprises an opening that goes through the first surface and the second surface and a metal column that is inserted in the opening. The LEDs are arranged on the metal column of the first surface. The invention further discloses a manufacturing method of the LED integrated encapsulation structure. In the provided structure, the non-metal substrate is combined with a metal column, which is used for heat dissipation of LED chips, and thus the problems that a circuit board is arranged on the metal substrate and the metal plate should be separated are solved.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting diode (LED) integrated encapsulation structure and manufacturing method thereof
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