Semiconductor package and fabrication method thereof

A semiconductor package and a fabrication method thereof. The fabrication method of the semiconductor package includes: bonding a first semiconductor chip having opposite first acting surface and first non-acting surface to a load bearing part with the first acting surface by means of an adhesion la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JI JIEYUAN, CHEN YANHENG, LIU HONGWEN, HUANG FUTANG, LV CHANGLUN, XU XIZHANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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